2/28/2023 0 Comments Reflow solder profile![]() ![]() For this reason, Coilcraft does not provide soldering profiles for our components.ĬAUTION: All of Coilcraft's through-hole components are designed to be wave soldered and it is not recommended to use a reflow soldering procedure. time limitation of the least robust component of the circuit board assembly ultimately dictates the optimal temperature profile. Soldering through-hole componentsĪll our RoHS-compliant parts are backward compatible with tin-lead soldering processes.įor all soldering methods, the optimal soldering profile for a circuit board assembly is dependent on the solder material, solder amount, flux, temperature limit of each soldered component, heat transfer characteristics of the circuit board and component materials, and the layout of all components. ![]() This typical reflow profile is provided only as a guide. No single reflow profile covers all possible circuit board designs. Large parts may require higher temperatures or a longer preheat time, whereas smaller parts (0201, 0402) may require extra considerations to avoid damage to the components.įollowing are general guidelines (See Table 1.) that should only be considered a starting point for development of a proper reflow profile that considers, at a minimum, part size, the specific customer-chosen solder alloy, and the PCB component population. "Flux" section of Kester Knowledge Baseĭownload Application Note – Soldering surface mount componentsįor all soldering methods, the optimal reflow profile for a circuit board assembly is dependent on several factors other than just the Coilcraft component and the chosen solder paste, such as the size and layout of all components.If not removed completely, water-soluble flux residue can cause immediate or latent corrosion.Ĭoilcraft strongly recommends consulting both the solder and water-soluble flux manufacturer for complete application information. Thorough rinsing and drying is required to remove water-soluble flux residue from all pc board areas, especially irregular component surfaces where contaminants can easily collect. All fine wire components, like many inductors, should be considered potentially susceptible. Water soluble fluxes can leave weak organic acid (WOA) residues that must be thoroughly removed from all pc board components. Concerns regarding the use of water-soluble flux ![]()
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